Wafer Cleaning - Flexible combinations for manifold cleaning processes & substrate types
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Cleaning processes
- Post CMP cleaning
- RCA cleaning
- Frontside, backside and edge bevel cleaning
- TSV cleaning
Main features
Select between wet-in/dry-out and dry-in/dry-out
Dry-in/dry-out, as well as, wetin/dry-out cleaning by spraying the substrate within the carrier are offered as standard, which enables optimized processes.
Various processes on a very compact platform
Even on our semi-automatic amr equipment and on our smallest amc 500 equipment frontside and backside cleaning may be integrated within the same module, so as to save additional machine space. A great variety of wafers, substrates and masks can be processed.
Great variety of cleaning media and processes
We offer all established cleaning processes. You will need less machines and therefore save cleanroom space because:
- Different cleaning media that are compatible with each other may be used within the same bowl
- Different cleaning methods may be combined flexibly in various process modules within oneequipment
Other important features
- Cleaning with brush, high pressure, megasonic, binary spray, mixing nozzles
- Spray nozzles with N2 support
- All established cleaning media are possible