Wafer Coating - Perfect, uniform coating layers
For your wafer and substrate coating processes we offer optimal, wellthought-out technical solutions that will help to meet your requirements and to reach best process results as far as homogeneity, layer thickness and edge bead removal are concerned. Our single wafer tools and processing modules support the use of a great variety of resists even such of very high viscosity.
Coating processes
- Positive- & negative coating
- SU8 coating
- PMMA coating
- Spray coating
- Thick-resist coating
Main features
Linear, triaxial positioning arm
All desired positions of the dispense nozzle aboce the substrate are freely programmable on the X, Y or Z axes with the help of our integrated servo control. This enables an absolutely accurate nozzle positioning and, furthermore, dispensing in a spiral or meandering movement. Calibrations or test-runs become unnecessary, but uniformity and resists savings increase enormously.
Innovative single nozzle gripper
The positioning arm only carries 1 nozzle at the time which holds two decisive advantages:
- No particle build-up due to friction of materials, for only one tube is being moved
- All nozzles not needed at the moment remain in the nozzle storage with rinse and dripping pan which prevents the nozzle tips from going dry and avoids any undesired dripping onto the substrate
RFID chuck-identification
The system will always recognize which chuck is being used at the moment and will so exactly adjust maximum rotation speed and eventual acceleration:
- User security is being increased drastically
- High processing flexibility for a great variety of substrates on different chucks
EBRsquare for square substrates
With the help of our special and singular EBR system, edge bead removal for square substrates or wafer flats may be started directly within the coater bowl:
- No need for wafer removal or repositioning
- EBR programming using absolute distance values
Air barrier cup
An optional air barrier cup forestalls the formation of edge beads on angular substrates:
- Better processing of high-viscosity resists
- Easier application of thick coating layers
- Noticeable improvement of homogeneity of the coating layer
- Optimized process results
- Minimized rejects
Puddle- und spray coating in one bowl
Because all the dispense arms of our equipment are being linearly moved, puddle and spray coating are possible within the same bowl:
- Separate spray coating station not necessary
- This saves machine space and time and increases flexibility of applications
- Energy savings due to the omission of the pneumatic system
Other important features
- All axles are linearly driven motor axles. In contrast to pneumatic axles, those can be positioned more precisely and programmed via software.
- EBR is also possible on a separate arm instead of on the dispense arm. This improves flexibility as well as the results of the coating process.
- The process bowl instead of the chuck rises and lowers when handling substrates in or out. This helps to stabilize the chuck drive considerably and it also enables highly dynamic functions.
- A variety of resist pumps to choose from: we can offer amcoss´ economic and innovative dispense systems such as motor driven syringe and trap tanks, but also every other resist pump that is available in the market.
- Due to our linearly driven motors up to 6 resists, EBR and pre-wet nozzle are possible within the same bowl.
- Our elaborate bowl design helps to avoid cotton candy when processing high viscosity resists and so guarantees optimum process results.
- Programmable rinse for wafer backside as well as coater bowl.
- Optional mini environment: the whole equipment or just parts of it can be temperature controlled. Therefore, comprehensive temperature and humidity control is possible.
- Contact-free wafer centering „on-the-move“, centering for square substrates or fully automated pre-aligment may be selected.
- Media temperature control through hose-hose temperature control is possible.