Wafer Developing - Great variety of applications, best results
Reliable and residue-free removal of positive- or negative-resists in well ajdusted development processes can be guaranteed with amcoss developer modules and technologies. At the same time the remaining wafer structures will not be affected, so that their original layer thickness stays intact. Even development of deep structures is possible. You choose from a great variety of comfortable options and processes and we will create development processes that have been perfectly designed to your needs. Smart features increase application flexibility, security, process precision and user convenience.
Developing processes
- Puddle developing
- Spray developing
- Developing with TMAH
- Developing with KOH
- Developing with solvents
- Megasonic-supported developing
Main features
Special bowl rinse
The developer process bowl is being cleaned with a novel rinse system:
- Avoids cristal- or particle build-up
- Eliminates the risk of wafer contamination
- Diminishes the reject rate noticeably
Smart chuck identification
With our automatic chuck identification, the system will always recognize which chuck is being used at the moment and will so exactly adjust maximum Rotation speed and eventual acceleration:
- User security is rising considerably
- Processing a wide range of
- Substrates on a variety of
- Chucks is possible
Bowl lowering and rising
The process bowl instead of the chuck is being lowered when depositing or withdrawing a wafer and raised during processing:
- Chuck drive remains stable
- Highly dynamic functions become possible
- Within our semi-automatic amr equipment manual Deposition of the substrate on the chuck is simple and more comfortable
DIW and media teperature control
Besides our standard hosehose media temperature control system, DI water may also be temperature controlled. A fact that helps to:
- Optimize process cycles
- Improve process results
Puddle and spray developing in one process bowl
The developer arm is linearly driven which offers multiple benefits:
- Puddle and spray development within one bowl are possible
- No need for a separate spray development station
- This saves machine space and process time
- Increased application flexibility
- Energy savings due to the absence of a pneumatic system
Megasonic-supported developing
Our optional megasonic-support has the advantage of faster media change on the substrate which helps to make development of deep structures, e.g. SU8, possible.
Other important features
- All movement axes are linearly driven motor axes. In contrast to pneumatic axes they may be positioned with greater precision and programmed via our software.
- Up to 5 developer media within one bowl are possible.
- Programmable surface and backside rinse of wafers.
- Servo-controlled nozzle positioning which can be programmed with absolute distance values in the ams pilot software.
- Optional temperature and humidity control