Wafer Heating/Cooling - For adjustable tempering of substrates
Main features
Great and flexible number of hotplates
Up to 5 hot- or coolplates are possible for one temperature module. In all automatic models every process module can be exchanged for a hotplate stack, so as to transform the equipment into a mere tempering tool.
Our semi-automatic tools can be completed with separate hoteplate modules in different sizes.
Especially comfortable access to plates
Due to our well-thought-out equipment design, access to the hotplates for maintenance from the back or the side of the machine is easy and comfortable, no matter where the stack is placed within the machine. Furthermore, the plates may be easily removed or fitted into free stacks.
Adjustable standard hotplate
Our standard hotplate with a temperature ramge from 60 to 200°C may be adjusted to the following settings (in reference to a 200 mm wafer):
- +/- 0.1 K uniformity
- +/- 0.5 K [lt]= 100°C
- +/- 1 % [gt]100°C
Other important features
- High-temperature hotplate (60 – 450 °C)
- HMDS vapor priming hotplate (60 – 200 °C)
- Single- or multizone-hotplates
- Coolplate (10 – 60 °C), with either water- or passive cooling
- Curing with UV-light or supported by UV-light
- Distance control to hotplate surface via fixed proximity, programmable proximity, vacuum contact
- Cover heating