Wafer Lift-off - Safe, effective, and user-friendly
Our customers may choose between a conventional lift-off process with traditional media or our elaborated lift-off process with DMSO megasonic. Compared to using traditional media under high-pressure conditions, this new process is significantly more efficient and secure.
Developing processes
- Standard metal lift-off with solvents like DMSO
- Protecting metal lift-off with DMSO megasonic
- Solvent strip
Main features
Reduced media teperature
DMSO Megasonic can be used at significantly lower temperatures (50°C), which results in shorter processing time and higher throughput. Moreover, it saves energy.
Protecting structures by not using high pressure
Megasonic lift-off works without high pressure during media dispense. So, this is a very gentle process and sensitive substrates and structures can be worked on without risking damage or breaking. reject and costs are being reduced.
Increased security
Traditional lift-off media have to be applied at temperatures close[nbsp] to their flashpoint, which constitutes an enormous safety risk. With megaonic lift-off media are being used at relatively low temperatures. So, the danger of inflammation does not exist and the whole process is safe for both man and machine.
Health protection
With megasonic lift-off there is NO atomized spray which could affect the operations' health at opening the machine. Also, cleaning, filtration, and assembly of the equipment in general, are being facilitated.
Variety of substrates without conversion
Our megasonic system is able to process any size and form of substrate as well as any substrate material by only choosing the correct chuck, but without any conversion.
Other important features
- High- or middle-pressure cleaning with DIW or solvents
- Special reclaim solution for very low media consumption
- Easy recycling of the lifted metals
- Programmable wafer backside, topside and bowl rinse