Temporary Bonding for Industrial Manufacturing
The fully automatic stand-alone system was designed for temporary bonding of individual substrates onto rigid carriers. This process provides mechanical support for further handling of very thin, sensitive substrates and flexible plastic materials. The unified and repeatable mounting process is ideal for applications such as CMP, grinding, polishing and etching. The n.varixx temporary bonding system has an integrated heating plate that can heat the carrier and substrates up to 200 °C and achieves void free bonds with ideal uniformity. Loading and unloading is done manually. Optionally, you can equip the system with an automatic handling system. The temporary bonding process is executed automatically.
TEMPORARY BONDING OF SUBSTRATES ONTO DIFFERENT CARRIERS
- Substrates on substrates
- Substrates on glass carrier
- Substrates on ceramic carrier
- Substrates on sapphire carrier
Different types of temporary Bonding adhesives can be used, such as spin-on thermoplast, thermoset materials, wax or tapes
AUTOMATED TEMPORARY BONDING PROCESS SYSTEM
- Application: temporary bonding
- Wafer sizes up to Ø 300 mm and square substrates up to 230 mm x 230 mm (9“ x 9“)
- 22" color touch screen for easy operation
- Integrated hotplate up to 200 °C
- High accuracy of wafer and carrier alignment
- Vacuum end effector with flip function
- I/O-Station open cassette, SMIF- or FOUP- loadports
- Compatible with silicon, compound and glass materials
Additional options:
- FFU / HEPA filter
- Vacuum pump
Temporary Bonding for Laboratories and R&D Facilities
The semi-automated loading and unloading system was designed for temporary bonding of individual substrates onto rigid carriers. This process provides mechanical support for processing very thin, delicate substrates and flexible plastic materials. A simple mounting process that is ideal for applications such as CMP, grinding, polishing, etching and lithography. Our semi-automatic temporary bonding system has an integrated heating plate that can heat the carrier and substrates up to 200 °C and achieves void free bonds with ideal uniformity (TTV).
COMPATIBLE MATERIALS: SILICON, COMPOUND AND GLASS
Debonding of backside grinded/thinned and polished wafers onto different types of carriers
- Wafer on wafer
- Wafer on glass carrier
- Wafer on sapphire carrier
- Wafer on ceramic carrier
Different types of debonding adhesives can be used, such as spin-on thermoplast, thermoset materials, wax or tapes.
DEBONDING DESIGNED FOR R&D AND LOW VOLUME PRODUCTION
This thermal slide debonding system was designed for separating temporarily bonded and processed wafer stacks consisting of a wafer, a carrier and a temporary interlayer adhesive. Debonding tool together with thermal influence achieves a careful and smooth demounting of the thinned wafers from the carrier. Our manual demounting system is available for 4 different wafer sizes up to Ø 300 mm. Qualified wafer materials including silicon, compound and glass materials, covering a broad spectrum of semiconductor materials.
MANUAL DEBONDING PROCESS SYSTEM
- Application: Debonding
- Wafer size from pieces up to Ø 300 mm
- Safe thin wafer handling
- Debonding with adjustable force
- Embedded heaters on wafer and carrier plates
- Temperature range adjustable up to 200°C
- Temperature uniformity of +/- 0.5°C
- Adjustable vacuum line to protect fragile/sensitive wafers
- Manual loading and unloading Compatible with silicon, compound and glass materials.