Self-Driving Lithography R&D Platform
Concept Study of an Integrated and Automated Cluster Tool
- Integrated System for Increased Efficiency, Precision, and Reproducibility
- High-Throughput Processing through Parallelization and 24/7 Execution
- Consistent Results through Fully Automated End-to-End Workflows
- Scalable, Modular, and Reconfigurable Platform Architecture
- Integrated Data Management Platform for AI‑Driven Design of Experiment
From Lab to Fab - and Back
At LAB14, we bridge the gap between advanced manufacturing and cutting‑edge research by transferring proven semiconductor manufacturing concepts into the laboratory. We bring the robustness, precision, and processing speed demanded by industrial users into the laboratory setting. Integrating this with data management and AI Tools elevates rigid process-optimized manufacturing technology to flexible research platforms. The resulting cluster systems speed up discovery and lay the foundation for seamless scale-up from lab-developed processes to fab-ready technologies.
About the concept
Self-Driving Labs
A Self‑Driving Laboratory is more than automated tools and robotics. It combines orchestrated process execution, continuous data capture, and AI‑assisted decision making into closed feedback loops. Experiments are planned, executed, evaluated, and iteratively optimized with minimal manual intervention. This turns complex lithography R&D into a repeatable,
scalable workflow that boosts throughput and reproducibility while staying adaptable to new materials, stacks, and patterning strategies.
Integration & Automation
Consistent integration of physical and digital Systems forms the foundation for autonomous workflows that run continuously and reproducibly. By interconnecting equipment, control, and data streams into an end-to-end process, integration enables seamless experimental operations. Automation builds on this base, ensuring that workflows can be executed reliably and in parallel. Consistent integration and Automation minimizes errors, reduces variability, and allows for extended periods of unattended operation.
Typical Lithography R&D cycle
Lithographic Workflows
The integration of the maskless lithography System with the automated single wafer processing enables continuous end-to-end workflows. All key lithography process steps are integrated, including substrate cleaning, adhesion promotion, photoresist coating, baking, alignment, exposure, and development. Depending on the process requirements, various deposition techniques can be used (e.g., spin coating, spray coating, and inkjet printing). Temperature-controlled hotplates set the correct conditions at any process step (i.e. for resist pre-bake, post exposure bake, and hard bake). A pre-aligner ensures the correct orientation of the substrate, when loaded into the maskless lithography system. The system provides additional global and local alignment for patterning on existing layers. Required process parameters can vary significantly depending on substrate materials and photoresists. Automated workflows facilitate finding the optimal process window by systematically changing Parameters such as exposure dose and focus. The high level of automation ensures repeatability of established processes where small factors such as substrate or developer temperature, or even Timing between process steps, can affect the workflow outcome.
Scalability
The lithography platforms of Heidelberg Instruments, combined with the modular cluster infrastructure of Notion Systems, enable scalable solutions from early laboratory research to high‑TRL development. Systems can be configured for compact cost-efficient laboratory setups with reduced cleanroom requirements, leveraging maskless lithography for rapid and
flexible patterning, expanded to mid‑size prototyping cleanrooms, or extended to full‑scale 300 mm development and manufacturing environments. Across all configurations, the same principles of automation, software control, and data integration apply. This allows the platform to scale not only in Substrate sizes and throughput, but also horizontally by integrating external process or characterization stations and by incorporating externally generated data into the same control and analysis framework. As a result, experimental workflows can grow in scope and complexity without breaking continuity from early Research to industrial development.
The Lithography Cluster in Detail
For automated single wafer processing, multiple cassettes with 150 mm, 200 mm, and 300 mm wafers can be loaded and unloaded. Flexible assignments of input/output locations and processes to each Cassette are possible.
Hotplates, cool-plates and vapor prime ovens are needed for pre-treatment of the wafer. Vapor prime ovens are often used with HMDS for better adhesion between substrate and resist. Hotplates for pre-treatment are sometimes used for a dehydration bake. Typical temperature ranges are room temperature to 250 °C with optional proximity baking and low O₂ atmosphere.
Spin-coating of wafers is either done in a Standard open bowl configuration or a covered chuck system, which yields highly uniform layers especially on square substrates or with very thick or thin resists. Multiple lines on the media arm allow for a flexible choice between different resists and solvent lines, which can be used for pre-wet, stripping, and EBR processes as well as for automated cleaning of the spin-bowl which enhances process stability especially when switching between different resists.
The system, based on Notion Systems’ n.varixx series, enables individual movement of a wide variety of Substrate sizes and shapes through the platform. The flexible scheduler software allows parallel process flows, maximizing efficiency when working on different applications simultaneously. In addition, external devices such as the shown lithography tool can be easily integrated.
At the heart of this cluster, Heidelberg Instruments swaps rigid, traditional mask-based technology for the flexibility of maskless lithography. The MLA 150 Maskless Aligner uses a Digital Mirror Device (DMD) as a dynamic mask, enabling precise, fast, and fully adaptable processing at any time. By going maskless, you eliminate high procurement costs and lead times, moving from a digital design to a patterned Substrate in minutes. This ability to “design-on-the-fly” is vital for cutting-edge applications. The MLA 150 delivers submicron resolution and automated alignment that compensates for substrate irregularities—Adjustments physical masks simply cannot make. It is a fast, intuitive solution designed to accelerate your research cycle while significantly lowering the total cost of ownership.
Cleaning of the substrate prior to coating can significantly increase yield. Standard cleaning techniques such as SPM, SC1 and SC2 supported by megasonic waves, high pressure, spray nozzles, or brushes can be integrated. Development of the resist after exposure is possible with all commonly used developer chemicals. The automatic media arm supports several media lines with various developer chemicals which are stored in an external media cabinet.
Post-treatment stations include hotplates and coolplates. Most common post-treatment is a soft-bake after coating. Further baking steps can take place after exposure for a post-exposure bake or after development for a hard-bake with same temperature ranges as for pre-treatment. Cool-plates allow for passive or active cooling after any preceding baking
step.
Specialists in Process and Automation
Future-Ready Microelectronics Manufacturing
Notion Systems GmbH is a pioneering provider of advanced equipment solutions for the electronics, display, and semiconductor industries. With a Focus on redefining the boundaries of microsystems and semiconductor manufacturing, we integrate worldclass automation, precision photolithography, and state-of-the-art industrial inkjet printing technologies into our product portfolio.
High Flexibility Combined with Excellent Uniformity and Process Repeatability
Our automated cluster systems set new Standards in advanced substrate processing. Thanks to highly configurable process modules, they adapt perfectly to your development needs while ensuring maximum precision, consistency, and efficiency. The system accommodates wafer sizes up to Ø 300 mm as well as square substrates up to 230 mm x 230 mm (9″ x 9″), ensuring maximum flexibility for diverse manufacturing requirements.
Specialists in Direct-Writing Lithography
Precision in Every Shot
For over 40 years, Heidelberg Instruments has been at the forefront of the micro- and nanofabrication world. We are more than just equipment manufacturers; we are the architects of the tools that enable tomorrow’s breakthroughs. With more than 1,500 systems installed across 50 countries, we have spent decades refining the art of maskless laser lithography and direct-write technology to support both academic research and industrial-scale production.
From Prototype to Production: What We Can Do
Our expertise lies in our versatility. We understand that the path from a researcher’s „Eureka!“ Moment o industrial-scale production is rarely a straight line. That is why our portfolio is designed to bridge every stage of the development cycle:
- R&D and Rapid Prototyping
- Industrial Power and Scalability
