n.amc powered by amcoss
Fully Automated Single Wafer Processing Systems up to 150 mm
With the amc series powered by amcoss we offer fully automated single wafer processing equipment for coating, developing, cleaning, heating/cooling, as well as lift-off and etching of wafers and other substrates. Every customer individually sets up their equipment according to their requirements as far as throughput and desired processing options are concerned.
Customer specific processes fit for future
Especially in microsystems technology the requirements to production processes and product quality, as well as cost pressure in wafer processing are high. We focus on our customers´ needs and on attractive cost-performance calculation. Therefore, every tool may be optimized either for flexible single processes or high throughput. Besides, ams PILOT software independently controls processes in every equipment and therefore supports the operator and optimizes all processes. So, with our equipment you will receive solutions for substrate coating, developing, cleaning, heating/cooling and lift-off, that contribute to reaching your goals.
Choosing the appropriate production equipment is a highly influential aspect of sustainability for a company and their products. With the acquisition of an amcoss equipment you not only opt for an intelligent technical solution, but for more efficiency in various respects.
Almost all features of the amc tools, e.g. linear motor drive for nozzle positioning or our special EBR solutions have been configured to enable and optimize flexible processes. ams PILOT software with its precise system control also highly contributes to that fact. So, throughput, as well as quality of the finished product increase, reject diminishes, downtime and prevention costs go down and time is being saved.
Optimized processes, attractive purchasing costs, a very good return on investment, low maintenance and spare parts costs, and longevity of all components, contribute to raising cost efficiency. Moreover, flexible process options and the great variety of processable substrates help to increase machine efficiency and reduce time for retrofits. Furthermore, the compact footprints of our amc equipment, as well as the option of a genuine through-the-wall installation save expensive cleanroom capacity.
Environmental protection is getting increasingly important in all aspects of life and it is also a heartfelt matter for amcoss, reflecting in our equipment. Thanks to the energy save mode of our ams PILOT software and the unique amcoss dispense system, an option for media re-use and the recycling of dissolved metals in the lift-off process, as well as other clever features, not only resists and media, but also energy can be saved. Consequently, there is less reject and waste. Because various processes can be run within one compact machine, its ecological footprint is generally smaller. At last, we try to keep our supply chain regional wherever possible.
Sustainability may not only be limited to technology, but has also to focus on humans. Production equipment has to be simple, comfortable and safe in operation. Our singular amc operation concept shows in all aspects of our amcoss equipment – in our user-friendly ams pilot software and a machine design enabling easy access to the modules, which can be effortlessly installed or removed, as well as in easy process adjustment. Moreover, many integrated features increase operator safety.
machine types
Modular, flexible individual - n.amc series
All n.amc models have been designed as adaptable platforms, so that individual configurations, process solutions and combinations are standard with amcoss. The footprints, however, are very compact and room saving. With, e.g. n.amc 1000 you will find 3 processes, 1 wafer-handling-station and up to 4 I/O stations on about 1 m² and you may flexibly process wafer sizes between 2“ and 6“.
n.amc 500
OUR MINI TOOL FOR INNOVATIVE WET PROCESSES
This extremely compact tool for wet processes enables you to make the most of your expensive cleanroom space:
- Wafer diameters: 2” up to 300 mm or up to 9 x 9”
- Up to 2 I/O stations for 2” to 200 mm open cassettes or 300 mm FOUP
- Max. 3 integrated individual chemical supply systems (more possible in external media unit)
- 1 two-link robot handler with single end effector for low contact handling
- Outer dimensions W x L: 740 x 1360 mm
- A separate enclosure of the process area made of resistant material extends the safety features.
n-amc 1000
OUR TRANSITIONAL MODEL TO FULLY AUTOMATIC LOW-SCALE PRODUCTION
Flexible machine configuration and processing of different wafer sizes:
- Wafer diameters: 2“ to 6“
- Up to 4 I/O stations for 2“ to 6“ (max. 4x open carriers or 2x SMIF) or
- Up to 2 I/O stations for 6“ (open carriers or SMIF)
- Max. 3 individually selectable process modules
- 1 two-link wafer handler
- Outer dimension W x L: 1236 mm x 1150 mm
n.amc 2000
OUR WORKHORSE; DESIGNED FOR FLEXIBLE USE OR VERY HIGH THROUGHPUT
Highly flexible machine configuration and processing of different wafer sizes:
- Wafer diameters: 2“ to 6“
- Up to 4 I/O stations for substrates 2“ to 6“ (max. 4x open carriers or 2x SMIF) or
- Max. 5 individually selectable process modules
- 1 two-link wafer handler
- Outer dimension W x L: 1382 mm x 1596 mm
n.amc 2500
OUR ALL-ROUNDER FOR MULTIPLE PROCESSES & SUBSTRATES
Compact service package for high throughput:
- Wafer diameter: 2“ bis &“
- According to configuration of wafer handling up to 4 I/O-stations (max. 4 x open carriers or 3 x SMIF)
- Max. 7 individually selectable process modules
- 2 two-link wafer handlers or
- 1 two-link wafer handler on linear track
- Outer dimension: W x L: 1414 mm x 2048 mm
