Semi-Automatic Systems for Lab Applications

n-unixx-SERIES

Spin & spray coater, developer, temperature and smartEBR modules are available as stand-alone or bench mounted configurations.
Base frame design allows various process modules configurations.
Round wafer up to Ø300 mm (Ø12 inch)
Square substrate size up to 230 x 230 mm (9 x 9 inch)

Main features

SPIN COATER

Applications:

Spin coating with Covered Chuck Processor (CCP) or open bowl

SPRAY COATER

Applications:

Spray coating for all topographies and shapes

HOTPLATES

Applications:

Softbake (pre-bake), hardbake, HMDS: vapor priming, vacuum drying, coolplates

DEVELOPER

Applications:

Developing, cleaning, drying

BONDING/DEBONDING

Substrates:

Glass, Saphire, Silicon, Ceramic, other materials on request

INKJET PRINTING

High precision inkjet printing for any substrate type or wafer size

Further processing tools

n.varixx

Automatic combined cluster systems

n.chemixx

Wet processing systems

n.maxx

Systems for large substrates