The n.jet semicon series offers a wide range of processes for frontend, as well as backend processes in the semiconductor industry. The platform comes with integrated edge handling for any substrate type or wafer size, integration with the MES system (e.g., SECS-GEM), and state-of-theart pre- and post-processing modules. Our nozzle replacement strategies and our full process control improve yield and process stability. The system can be combined with high-precision dispensing units that further enlarge the window of processable materials within the same platform.
- Photo resist printing
- Deposition of sensor active inks
- Chip packaging
- Printing of dielectrics, conductives, resists, adhesives